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All standards are only available as Printable Download Format (PDF) downloads or electronic files. You will be able to download immediately after approved purchase. Each PDF is stamped with your company name and transaction number. You may distribute them only within your company.  A complete list of all standards available for purchase can be found at https://www.vita.com/Standards.

Employees of VITA Member companies do NOT need to purchase standards from this online store, they may download from the VITA website. Confirm your company membership before purchasing. If your company is an active member and you do not have an account, you will need to register with VITA before you can download standards.

ANSI/VITA 01-1994 (S2021), VME64 (VMEbus)

VME64 Standard: This standard covers the main body of the VMEbus specification. It includes both 32 bit and 64 bit usage.

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ANSI/VITA 01.1-1997 (S2021), VME64x Extensions

VME64 Extensions: This standard covers extensions to the VME64 specification including the 160 pin connector, geographical addressing, and added power pins.

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ANSI/VITA 01.3-1997 (S2021), VME64x 9U x 400 mm Format

VME64x 9U x 400 mm Format: This standard defines a 9U x 400 mm board layout for use within the VMEbus framework.

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ANSI/VITA 01.5-2003 (S2014), VME 2eSST

VME 2eSST (Two Edge Source Synchronous Transfer): This standard defines a new transfer protocol, based upon source synchronous concepts, that currently permits the VMEbus to operate at rates up to 320MB/sec. Reaffirmed in 2009 and moved to stabilized maintenance in 2014.

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ANSI/VITA 01.6-2000 (S2021), Keying for Conduction Cooled VME64x

Keying for Conduction Cooled VME64x: This standard defines an alternate keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101.2) where keying as defined in the VME64 Extensions standard cannot be applied.

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ANSI/VITA 01.7-2003 (S2014), Increased Connector Current Level

Increased Connector Current Level: This standard describes increased current levels, test methods, test data and compliance criteria for 3-row DIN and 5-row DIN connectors when used in VME, VME64 and VME64 Extension P1/J1 and P2/J2 pin out arrangements. Reaffirmed in 2009. Stabilized in 2014.

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ANSI/VITA 17.1-2015 (R2022), Serial Front Panel Data Port (sFPDP)

Serial Front Panel Data Port: This standard defines "Serial FPDP", a high-speed low-latency serial communications protocol for use in high-speed data transfer applications, typically using a fiber optic link. Revised 2015, Reaffirmed 2022.

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ANSI/VITA 17.3-2018, Serial Front Panel Data Port (sFPDP) Gen 3

Standard for third generation Serial Standard Front Panel Data Port (sFPDP), a high-speed low-latency serial communications protocol. Supports multi-lane channel bonding and advanced 64B/67B encoding to increase the bandwidth capabilities.

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ANSI/VITA 20-2005 (S2018), Conduction Cooled PMC

Conduction Cooled PMC: This standard defines the mechanical specifications for a conduction cooled PMC module.

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ANSI/VITA 32-2003 (S2014), Processor PMC

Processor PMC: This standard incorporates a set of extensions to the IEEE 1386.1 PMC (PCI Mezzanine Card) standard which creates a new class of CPU-based PMC cards referred to in this standard as Processor PMC cards - standard retains electrical signaling compatibility with existing PMC cards. Reaffirmed in 2009. Stabilized in 2014.

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ANSI/VITA 35-2000 (S2021), PMC-P4 Pin Out for VME-P0 and VME64x

PMC-P4 Pin Out Mapping To VME-P0 and VME64x-P2: This standard defines pin assignments for PMC P4 connector to VME P0 and P2 connectors.

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ANSI/VITA 40-2020, Service and Status Indicator Standard

Service and Status Indicator Standard: This standard defines the colors, behaviors, placement, and labeling of service indicator lamps for boards, field replaceable units, and enclosures.

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ANSI/VITA 41.6-2009 (R2016), VXS 1X Gbit Enet Control Channel Std

VXS 1X Gbit Ethernet Control Channel Standard: This standard describes a method for implementing ethernet as a control channel on ANSI/VITA 41.0, VXS.

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ANSI/VITA 42.0-2021, XMC: Switched Mezzanine Card Auxiliary Standard

XMC Switched Mezzanine Card: This document defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed mezzanine card form factor. This revision (2021) adds updated signal integrity data for PCIe capabilities as well as revised connector drawings.

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ANSI/VITA 42.2-2006 (S2018), XMC Serial RapidIO Protocol Std

XMC Serial RapidIO Protocol Layer: This standard defines the implementation of Serial RIO on VITA 42.0, XMC.

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ANSI/VITA 42.3-2020, XMC PCI Express Protocol Layer Std.

XMC PCI Express Protocol Layer: This standard defines the implementation of PCI Express on VITA 42.0, XMC.

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ANSI/VITA 42.6-2009 (R2015), XMC 10 Gigabit Ethernet 4-Lane Std

XMC 10 Gigabit Ethernet 4-Lane Protocol Layer: This standard defines a method for supporting 10 Gigabit Ethernet using XAUI switched interconnect protocol on the XMC form factor.

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ANSI/VITA 46.0-2023, VPX Base Standard

VPX Base Standard: This standard defines the implementation of VPX. Revised in 2013, 2019, and 2023.

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ANSI/VITA 46.01-2007 (S2018), VMEbus Signal Mapping on VPX

VMEbus Signal Mapping on VPX: This standard defines the mapping of VMEbus signals on ANSI/VITA 46.0, VPX. Reaffirmed in 2013. Sustained maintenance in 2018.

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ANSI/VITA 46.03-2012 (R2018), Serial RapidIO™ on VPX Fabric Connector

Serial RapidIO™ on VPX Fabric Connector: This standard assigns Serial RapidIO ports to the VPX P1/J1 connector.

Reaffirmed June 2018

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ANSI/VITA 46.04-2012 (R2018), PCI Express® on VPX Fabric Connector

PCI Express® on VPX Fabric Connector: The objective of this standard is the implementation of the PCI Express® Fabric in the VITA46 environment and to define the mapping of the PCI Express® Links on the VPX Connector.

Reaffirmed August 2018

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ANSI/VITA 46.06-2013 (R2018), Gigabit Ethernet Control Plane on VPX

Gigabit Ethernet Control Plane on VPX: The objectives of this standard are to assign Gigabit Ethernet Port mappings for the purpose of Control Plane communication onto the VPX connectors for both 3U and 6U form factors and to provide rules and recommendations for the interoperable implementation and use of said Gigabit Ethernet Port mappings.

Reaffirmed: August 2018

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ANSI/VITA 46.07-2012 (R2018), Ethernet on VPX Fabric Connector

Ethernet on VPX Fabric Connector: The objectives of this standard are to assign backplane Ethernet links to the VPX P1/J1 connector and to provide rules and recommendations for the use of Ethernet over backplane media.

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ANSI/VITA 46.09-2018, PMC/XMC Rear I/O Fabric Signal Mapping

PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules Standard: This VITA 46 (VPX) subsidiary standard defines PMC or XMC mezzanine rear I/O pin mappings to VITA 46.0 plug-in module backplane connectors.

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ANSI/VITA 46.10-2009 (R2015), Rear Transition Module for VPX

Rear Transition Module for VPX: This standard defines a rear transition module (RTM) for VPX applications.

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ANSI/VITA 46.11-2022, System Management on VPX

System Management on VPX: This specification defines a system management architecture on VPX.

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ANSI/VITA 46.30-2020, Higher Data Rate VPX

Higher Data Rate VPX: This standard defines a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higher data rate connectors compliant to VITA 46.30 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

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ANSI/VITA 47 Bundle, Environment Standards for Plug-In Units, Includes all standards.

Requirements for Environments, Design and Construction, Safety, and Quality for Plug-In Modules Standard

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ANSI/VITA 48.0-2022, Rugged Mechanical Standard for Microcomputers (VPX REDI)

Mechanical Standard for Microcomputers Using Ruggedized Enhanced Design Implementation (VPX REDI): This standard defines a mechanical implementation for Plug-In Modules. Two types of Plug-In Modules are defined: Type 1 and Type 2. Both Type 1 and Type 2 Plug-In Modules take advantage of increased slot pitch to provide enhanced thermal performance and increased structural durability. Type 1 units support Two Level Maintenance while Type 2 units do not.

This revision adds allowance for a 100 mm Plug-In Module depth and allows for additional pitches to be defined in the VITA 48 Dot Standards.

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ANSI/VITA 48.1-2020, Mechanical Standard for Microcomputers Air Cooling

Mechanical Specification for Microcomputers Using REDI Air Cooling: This standard defines the mechanical requirements that are needed to insure the mechanical interchangeability of air cooled 3U and 6U plug-in units and define the features required to achieve 2 Level Maintenance compatibilly.

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ANSI/VITA 48.2-2022, Mechanical Standard for Conduction Cooling VPX

Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility.

This revision adds a 100 mm depth and multiple pitches at 0.2" increments.

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ANSI/VITA 48.4-2022, Mechanical Standard for VPX REDI, Liquid Flow Through Cooling

Mechanical Standard for VPX REDI, Liquid Flow Through Cooling: This standard establishes the mechanical design requirements for a LFT cooled electronic VPX module.

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ANSI/VITA 48.5-2010 (R2017), Mechanical Standard for Modules Air Cooling

Mechanical Standard for Electronic Plug-in units Using Air Flow Through Cooling: This standard establishes the design requirements for an air-flow-through cooled plug-in unit with a form factor as close to 6U as possible while retaining the VITA 46 connector layout. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components and circuit boards, this plug-in unit uses a compact core heat exchanger located within the central heat sink of the unit. (Reaffirmed 2017)

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ANSI/VITA 48.7-2023, Mechanical Standard for Plug-in units Air Flow-By cool

Mechanical Standard for Electronic Plug-in units using Air Flow-By™ Cooling Technology

This standard defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VITA 46/48. Air Flow-By cooling seals, environmentally and EMI, the PCBA within heat exchanging covers, convectively cooling the assembly without exposing the PCBA to the cooling air.

This revision provides additional design clarity, removes dependencies on external documentation, adds requirements for plug-in module specifications, and updates recommendations to better guide design practice.

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ANSI/VITA 48.8-2022, Mechanical Standard for VPX REDI, Air Flow Through Cooling, 1.0" to 1.5" Pitches

Mechanical Standard for VPX REDI, Air Flow Through Cooling, 1.0" to 1.5" Pitches: This document describes an open standard for the design requirements for an airflow-through cooled plug-in module having 3U and 6U form factors while retaining the VITA 46.0 connector layout. Unlike using cooling air impinged directly upon the components and circuit boards, this plug-in module uses a finned heat exchanger frame located within the central section of the assembly to top cool primary circuit board components as well as mezzanine board components. Both 3U and 6U standard form factors are offered using 3 defined pitch spacings, with options to have alternate air flow intake and exhaust paths. The plug-in modules of this standard exhibit a weight reduction and cost savings by eliminating both wedge retainer usage and module lever usage by way of using light weight jack screws for plug-in module insertion and extraction into a subrack chassis. The intention of this standard is to optimize SWAP-C (Size, Weight, Power, Cost).

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ANSI/VITA 49.0-2015 (R2021), VITA Radio Transport (VRT) Standard

VITA Radio Transport (VRT) Standard: The VITA Radio Transport (VRT) standard defines a transport-layer protocol designed to promote interoperability between RF (radio frequency) receivers and signal processing equipment in a wide range of applications.

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ANSI/VITA 49.1-2015 (R2021), VITA Radio Protocol (VRL) Standard

VITA Radio Link Layer Protocol (VRL) Standard: This standard specifies an optional encapsulation protocol for VITA-49.0 (VRT) packets.

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ANSI/VITA 49.2-2017, VRT Standard for Electromagnetic Spectrum

VRT Standard for Electromagnetic Spectrum: Defines a signal/spectrum protocol that expresses spectrum observation, spectrum operations, and capabilities of RF devices. This is done independent of manufacturer, equipment type, point of use in an architecture and application. The intent of the VRT protocol is to enable RF systems to migrate from proprietary stove-pipe architectures to interoperable multi-function architectures.

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ANSI/VITA 49A-2015 (R2021), Spectrum Survey Interoperability Standard

Spectrum Survey Interoperability Standard: This document specifies an interoperability specification that is applicable to spectrum-survey applications. It is intended to foster high-throughput and adaptable processing in a large-scale environment. It specifically considers the needs of devices based around 32-/64-bit general-purpose processors (GPP) and FPGAs that utilize Internet Protocol (IP) as the underlying transport between processing devices.

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ANSI/VITA 51.0-2012 (R2018), Reliability Prediction

Reliability Prediction: This document provides an electronics failure rate prediction standard, and establishes a Community of Practice. It addresses the limitations of existing prediction practices with a series of subsidiary specifications that contain the “best practices” within industry for performing electronics failure rate predictions. The development of ANSI/VITA 51.0 and the subsidiary specifications is an effort to give the mean time between failure (MTBF) calculations consistency and repeatability. 

Designation corrected to ANSI/VITA 51 - 2012 (R2018). Standard was revised in 2012 and reaffirmed with no changes in 2018.

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ANSI/VITA 51.1-2013 (R2018), Rel Pred MIL-HDBK-217 Subsidiary Standard

Reliability Prediction MIL-HDBK-217 Subsidiary Standard: This specification provides standard defaults and methods to adjust the models in MIL-HDBK-217F Notice 2. This is not a revision of MIL-HDBK-217F Notice 2 but a standardization of the inputs to the MIL-HDBK-217F Notice 2 calculations to give more consistent results.

Reaffirmed: October 10, 2018

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ANSI/VITA 51.2-2016, Physics of Failure Reliability Predictions

Physics of Failure Reliability Predictions: This standard provides processes, instructions and default parameters for using the Physics of Failure (PoF) approach for modeling the reliability of electronic products. It includes a discussion of the philosophy, context for use, definitions, models for key failure mechanisms, definition of the input data required, default values if technically feasible or the typical range of values as a guideline. It defines how modeling results are interpreted and used. It requires the documentation of modeling inputs, assumptions made during the analysis, modifications to the models and rationale for the analysis.

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ANSI/VITA 51.3-2010 (R2016), Qual & Environ Stress Screening

Qualification and Environmental Stress Screening in Support of Reliability Predictions: This standard provides rules, permissions, and observations to assure that cost effective Qualification and Environmental Stress Screening support valid reliability predictions and enhance electronics reliability. It includes a discussion of the systems engineering relationships between Qualification, Environmental Stress Screening, and reliability.

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ANSI/VITA 57.4-2018 +Errata, FPGA Mezzanine Card Plus (FMC+) Standard

FPGA Mezzanine Card Plus (FMC+) Standard: This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mechanical standard. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Additional signals to support backplane reference clock and synchronization have been added. The VITA 57.4 specification is backwards compatible in that a VITA 57.4 carrier card can still support a VITA 57.1 FMC.

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ANSI/VITA 60.0-2012 (R2018), Alternative Connector for VPX

Alternative Connector for VPX: This standard provides an alternate connector to the one specified in the VITA 46.0 VPX Baseline Standard. Because the 46.0 and the 60.0 connectors are not intermateable, a VITA 60.0 module will not plug into a VITA 46.0.0 backplane and vice versa. However, the VITA 60.0 standard provides VPX users with the flexibility to choose a VPX module and backplane connector combination for their specific application requirements.

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ANSI/VITA 61.0-2022, XMC 2.0

XMC 2.0: This standard is based upon VITA 42.0 XMC.  It defines an open standard for supporting high-speed, switched interconnect protocols on the existing, widely deployed XMC form factor.  XMC 2.0 utilizes a ruggedized, higher speed mezzanine interconnect based on pin and socket technology featuring multiple points of contact.  This revision addresses additional connector stack heights, lower mating force variants and support for higher data rate protocols.

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ANSI/VITA 62.0-2022, Modular Power Supply Standard

Modular Power Supply Standard: This standard provides requirements building a power supply module that can be used to power a VPX chassis. The module will fit within the standard envelope defined for VPX modules in the VITA 48.x standards.

This revision updates the standard to better define current configurations and usage. The changes are delineated in the Forward of this standard.

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ANSI/VITA 62.1-2023, Three Phase High-Voltage Power Supply Front- End in a 3U Plug-In Module Standard

This standard provides requirements for a Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module that can be used to power a VPX chassis in the VITA 62 family of standards. The Plug-In Module will fit within the standard envelope defined for VPX Plug-In Modules in the VITA 48.0 standards.

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ANSI/VITA 62.2-2020, Modular Power Supply Standard for 270V Applications

Modular Power Supply Standard: This standard provides requirements for building a 270 volt/3U or 6U class power supply module that can be used to power a VPX chassis in the VITA 62 family of standards in high altitude applications. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.

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ANSI/VITA 63.0-2015 (R2022), Hyperboloid Alternative Connector for VPX

Hyperboloid Alternative Connector for VPX: This document describes an open standard for VITA 63.0 Hyperboloid Alternative Connector for VPX. This standard provides an alternative connector to the one specified in the VITA 46.0 VPX Baseline Standard.

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ANSI/VITA 65.0-2023, OpenVPX System Standard w/ANSI/VITA 65.1 Profile Tables

OpenVPX: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses Plug-In Module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of Slot, Backplane, Module, and Standard Development Chassis Profiles.

This revision adds additional communication protocols, including protocols for supporting video. The associated VITA 65.1 adds Connector Modules and Slot Profile dash options to support 75 Ω coax.

Includes ANSI/VITA 65.1 profile tables. Excel version available at www.vita.com/Supporting-Information.

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ANSI/VITA 66.0-2016, Optical Interconnect On VPX - Base Standard

Optical Interconnect on VPX - Base Standard: The VITA 66.0 base standard defines physical features of a stand-alone compliant blind mate Optical Interconnect for use in VPX systems.

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ANSI/VITA 66.1-2012, Optical Interconnect On VPX - MT Variant

Optical Interconnect on VPX - MT Variant: The VITA 66.1 standard defines an MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

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ANSI/VITA 66.2-2013 (R2018), Optical Interconnect VPX ARINC 801 Termini

Optical Interconnect on VPX - ARINC 801 Termini Variant: The VITA 66.2 standard defines an ARINC 801 Termini Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Reaffirmed August 2018

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ANSI/VITA 66.3-2012 (R2018), Optical Interconnect VPX - Mini-Exp Beam

Optical Interconnect on VPX - Mini-Expanded Beam Variant: The VITA 66.3 standard defines an MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Reaffirmed: September 28, 2018

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ANSI/VITA 66.4-2016, Optical Interconnect VPX - Half Width MT

Optical Interconnect on VPX - Half Width MT Variant: The VITA 66.4 standard defines a Half Width MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

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ANSI/VITA 66.5-2022, Optical Interconnect on VPX - Hybrid Variants

Optical Interconnect on VPX - Hybrid Variants: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug-In Module and floating displacement on the backplane.

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ANSI/VITA 67.0-2019, Coaxial Interconnect on VPX - Base Standard

Coaxial Interconnect on VPX - Base Standard: The objective of this standard is to establish a structure for implementing blind mate analog coaxial interconnects with VPX backplanes and plug-in modules, and to define a specific family of interconnects and configurations within that structure.

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ANSI/VITA 67.1-2019, Coaxial Interconnect VPX, 3U, 4 Position, SMPM

Coaxial Interconnect on VPX, 3U, 4 Position, SMPM Configuration: The objective of this standard is to detail the configuration and interconnect within the structure of VITA 67.0 enabling a 3U VITA 46 interface containing multi-position blind mate analog connectors with up to 4 SMPM contacts.

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ANSI/VITA 67.2-2020, Coaxial Interconnect VPX, 8 Position SMPM

Coaxial Interconnect on VPX, 8 Position SMPM Configuration: The objective of this standard is to detail the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connectors with up to 8 SMPM contacts each able to be located in positions P2/J2 to P6/J6.

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ANSI/VITA 67.3-2023, Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane

Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane: This document describes an open standard for configuration and interconnect within the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane.  This revision adds 75-Ohm SMPM and 75-Ohm NanoRF contact interfaces to support video applications.

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ANSI/VITA 68.0-2017, VPX Compliance Channel

VPX Compliance Channel: VITA 68.0 is the Base Standard of the VITA 68.x family of standards for signal integrity compliance of VPX systems and components.This standard provides an overview of the VITA 68.x family of standards and defines common requirements for VPX modules and VPX backplanes that apply across the range of VITA 68.x standards.

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ANSI/VITA 68.1-2017 +Errata, Fixed Signal Integrity Budget

Fixed Signal Integrity Budget: This standard defines a VPX compliance channel fixed signal Integrity budget including module performance criteria and common backplane performance criteria required to support multiple fabric types across a range of defined baud rates.

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ANSI/VITA 68.2-2021, VPX Standard S-Parameter Definition

VPX Standard S-Parameter Definition: This standard leverages the VITA 68.0 S-parameter definition and expands upon how the S-parameters are formatted and named to help system integrators easily take multiple vendor S-parameters, concatenate them together to analyze an entire channel from one Module to another Module.

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ANSI/VITA 74.0-2022, Compliant System Small Form Factor Module (VNX) Base Standard

VNX - Compliant System Small Form Factor Module: This standard meets the growing needs for improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module, whilst leveraging many proven features of existing VITA standards.

This edition documents the migration from VITA 74 VNX to VITA 90 VNX+ family of standards, adds revised voltage levels for specific signals, as well as corrected connector part numbers and drawings.

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ANSI/VITA 76.0-2016 (R2021), Ruggedized 10 Gbaud Bulkhead Connector

Ruggedized 10 Gbaud Bulkhead Connector Standard: Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables

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ANSI/VITA 78.0-2022, SpaceVPX Systems

SpaceVPX Systems standard: This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications.  Such systems support a wide variety of use cases across the aerospace community.  This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards. This revision adds additional profiles, additional communication protocols (such as Ethernet), higher speed copper connectors, and an updated naming methodology for Slot and Module Profiles.

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ANSI/VITA 86-2019, High Voltage Input Sealed Connector Power Supply Standard

High Voltage Input Sealed Connector Power Supply Standard: This standard defines an environmentally sealed connector pair which is compatible with the backplane footprint as defined in VITA 62.0 for 3U power supplies operating in harsh environments operating off of a high voltage input.

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ANSI/VITA 88.0-2021, Switched Mezzanine Card Plus (XMC+) Standard

This document defines a standard for improved electrical/mechanical mezzanine connectors for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.

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FMC Bundle: Includes ANSI/VITA 57.1-2019 and 57.4-2018, FPGA Mezzanine Card (FMC) Standard

FPGA Mezzanine Card (FMC) Standard: This standard describes the compliance requirements for an FPGA Mezzanine Card (FMC) IO module which utilizes a mezzanine module to provide for a low overhead protocol bridge between a carrier card's front panel IO and an FPGA processing device on the carrier card. (Revised in 2019)

Includes ANSI/VITA 57.4-2018 +Errata.

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VITA 03-1995 (S2022), Board Level Live Insertion

Board Level Live Insertion: This standard defines several methodologies for using VMEbus modules in a live insertion framework.

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VITA 04-1995 (S2022), IP Module

IP Module: This standard defines the requirements for a business card sized mezzanine module printed circuit board.

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VITA 04.1-1996 (S2022), IP I/O Mapping to VME64x

IP I/O Mapping to VME64x: This standard defines the pin assignments from IP Modules to the VME64x P0 and P2 connectors.

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VITA 05.1-1999 (S2022), RACEway Interlink on VME

RACEway Interlink on VME: This standard defines a high speed circuit switched point to point interconnect for use between VMEbus modules via the P2 connector.

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VITA 06-1994 (S2022), SCSA on VME

SCSA: This standard defines an isochronous backplane bus for telephony applications on the VMEbus P2 connector.

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VITA 06.1-1996 (S2022), SCSA Extensions

SCSA Extensions: This standard provides feature extensions to the VITA 6.0 standard.

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VITA 12-1997 (S2022), M-Module

M-Module: This standard defines a mezzanine module specification for small sized printed circuit boards.

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VITA 17-1998 (S2022), Front Panel Data Port (FPDP)

Front Panel Data Port: This standard defines a point to point data interconnect for use on front panel Eurocard modules.

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VITA 23-1998 (S2022), VME64 Extensions for Physics

VME64 Extensions for Physics: This standard defines a series of recommended practices for the use of VMEbus in the physics community.

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VITA 26-1998 (S2022), Myrinet on VME Protocol

Myrinet: This standard defines a packet switched interconnect protocol for implementation in a VMEbus environment.

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VITA 29-2001, PC*MIP

PC*MIP Standard

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VITA 30-2000 (S2022), 2mm Equipment Practice for Eurocard

2mm Equipment Practice for Eurocard Systems: This standard defines an equipment practice based on IEC 61076-4-101, subracks, racks, and printed boards based on the Euroboard form factor.

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VITA 30.1-2008 (S2022), 2mm Eqmt Practice for Cond. Cooled

2mm Equipment Practice for Conduction Cooled Eurocard Systems: This standard provides the mechanical dimensions for conduction cooled Euroboard systems that use 2mm connectors. Released in 2002 and revised in 2008.

$50.00

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VITA 31.1-2003 (S2022), Gigabit Ethernet on VME64x

Gigabit Ethernet on VME64x Backplanes: This standard defines a pinout and interconnection methodology for implementing a 10/100/1000BASE-T Ethernet switched network on a VME64x backplane.

$25.00

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VITA 38-2003 (S2022), System Management on VME

System Management on VME: This standard defines a methodology for using IPMI for System Management of VME systems. Reaffirmed in 2008. Stabilized in 2013.

$25.00

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VITA 39-2003 (S2022), PCI-X for PMC and Processor PMC

PCI-X for PMC and Processor PMC: This standard integrates the PCI-X capability from PCI to PMC-based products, including standard PMCs as well as Processor PMCs.

$25.00

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VITA 41.0-2006 (S2022), VMEbus Switched Serial Std (VXS)

VXS - VMEbus Switched Serial Standard: This standard defines a method for using switched serial fabrics within the VMEbus framework.

$75.00

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VITA 41.1-2006 (S2022), VXS 4X InfiniBand Protocol Std

VXS 4X InfiniBand Protocol Layer Standard: This standard describes a method for using the InfiniBand protocol on VITA 41.0, VXS.

$25.00

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VITA 41.2-2006 (S2022), VXS 4X Serial Rapid IO Protocol Std

VXS 4X Serial RapidIOT Protocol Layer Standard: This standard describes a method for implementing Serial Rapid I/O on VITA 41.0, VXS.

$25.00

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VITA 42.1-2006 (S2022), XMC Parallel Rapid IO 8/16 LP-LVDS

XMC Switched Mezzanine Card: Parallel RapidIOT 8/16 LP-LVDS Protocol Layer Standard - This standard defines the implementation of Parallel RIO on VITA 42.0, XMC.

$50.00

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VITA 46.31-2020-VDSTU, Higher Data Rate VPX, Solder Tail

Higher Data Rate VPX, Solder Tail: This standard defines a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

$50.00

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VITA 53.0-2010 (S2022), Commercial Technical Market Surveillance

Commercial Technology Market Surveillance: This standard describes the types of market surveillance data needed by Department of Defense program managers in order to develop and implement technology refresh plans.

$25.00

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VITA 58.0-2009 (S2022), Line Replaceable Chassis Standard

Line Replaceable Integrated Electronics Chassis Standard: This standard provides common design and performance requirements for a family of integrated electronic chassis incorporating updated industry standard high speed electronic assemblies and designed for rugged environments

$25.00

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VITA 58.1-2013 (S2022), Line Replaceable Std, Liq Cooled Chassis

Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis: The objective of this standard is to identify the particular requirements for a chassis configuration conforming to the VITA 58.0 base standard.

$25.00

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VITA 75.0 - VDSTU, VITA 75 Rugged Small Form Factor - Base Standard

VITA 75 Rugged Small Form Factor - Base Standard: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes overall subsystem attributes such as the envelope of the subsystem (box) and the organization of the dot specifications.

$25.00

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VITA 75.11 - VDSTU, Rugged Small Form Factor - Subsystem I/O Interface

Rugged Small Form Factor - Subsystem I/O Interfaces: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of front panels, connectors, I/O signal pin assignments, and power for VITA 75 subsystems.

$100.00

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VITA 75.20 - VDSTU, Rugged Small Form Factor - Cooled Free Air

Rugged Small Form Factor - Cooled via Free Air Convection: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of mounting and cooling for free air convection cooled VITA 75 subsystems.

$25.00

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VITA 75.22 - VDSTU, Rugged Small Form Factor - Cooled Cold Plate

Rugged Small Form Factor - Cooled via Conduction to Cold Plate: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of mounting and cooling for conduction to a cold plate cooled VITA 75 subsystem.

$25.00

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VITA Custom Payment

This is an alternate Credit Card payment method for those members having issues with payment rejections via www.vita.com site.

$200.00

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VITA Regular Membership Annual Dues

Annual dues for Regular I membership renewal at VITA

$3,000.00

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VMEbus Handbook, 4th Edition

A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. The handbook complements the VMEbus standard and provides examples and explanatory text for all facets of the VMEbus architecture.

$100.00

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VSO F2F Attendance Fee

Alternate payment portal for attendees of VSO Face to Face (F2F) meetings.  Only purchase if normal event payment method is failing.

$160.00

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