VME64 Standard: This standard covers the main body of the VMEbus specification. It includes both 32 bit and 64 bit usage.

VME64 Extensions: This standard covers extensions to the VME64 specification including the 160 pin connector, geographical addressing, and added power pins.

VME64x 9U x 400 mm Format: This standard defines a 9U x 400 mm board layout for use within the VMEbus framework.

VME 2eSST (Two Edge Source Synchronous Transfer): This standard defines a new transfer protocol, based upon source synchronous concepts, that currently permits the VMEbus to operate at rates up to 320MB/sec. Reaffirmed in 2009 and moved to stabilized maintenance in 2014.

Keying for Conduction Cooled VME64x: This standard defines an alternate keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101.2) where keying as defined in the VME64 Extensions standard cannot be applied.

Increased Connector Current Level: This standard describes increased current levels, test methods, test data and compliance criteria for 3-row DIN and 5-row DIN connectors when used in VME, VME64 and VME64 Extension P1/J1 and P2/J2 pin out arrangements. Reaffirmed in 2009. Stabilized in 2014.

Serial Front Panel Data Port: This standard defines "Serial FPDP", a high-speed low-latency serial communications protocol for use in high-speed data transfer applications, typically using a fiber optic link. Revised 2015, Reaffirmed 2022.

Standard for third generation Serial Standard Front Panel Data Port (sFPDP), a high-speed low-latency serial communications protocol. Supports multi-lane channel bonding and advanced 64B/67B encoding to increase the bandwidth capabilities.

Conduction Cooled PMC: This standard defines the mechanical specifications for a conduction cooled PMC module.

Processor PMC: This standard incorporates a set of extensions to the IEEE 1386.1 PMC (PCI Mezzanine Card) standard which creates a new class of CPU-based PMC cards referred to in this standard as Processor PMC cards - standard retains electrical signaling compatibility with existing PMC cards. Reaffirmed in 2009. Stabilized in 2014.

PMC-P4 Pin Out Mapping To VME-P0 and VME64x-P2: This standard defines pin assignments for PMC P4 connector to VME P0 and P2 connectors.

Service and Status Indicator Standard: This standard defines the colors, behaviors, placement, and labeling of service indicator lamps for boards, field replaceable units, and enclosures.

XMC Switched Mezzanine Card: This document defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed mezzanine card form factor. This revision (2021) adds updated signal integrity data for PCIe capabilities as well as revised connector drawings.

XMC Serial RapidIO Protocol Layer: This standard defines the implementation of Serial RIO on VITA 42.0, XMC.

XMC PCI Express Protocol Layer: This standard defines the implementation of PCI Express on VITA 42.0, XMC.

XMC 10 Gigabit Ethernet 4-Lane Protocol Layer: This standard defines a method for supporting 10 Gigabit Ethernet using XAUI switched interconnect protocol on the XMC form factor.

VPX Base Standard: This standard defines the implementation of VPX. Revised in 2013, 2019, and 2023.

VMEbus Signal Mapping on VPX: This standard defines the mapping of VMEbus signals on ANSI/VITA 46.0, VPX. Reaffirmed in 2013. Sustained maintenance in 2018.

Serial RapidIO™ on VPX Fabric Connector: This standard assigns Serial RapidIO ports to the VPX P1/J1 connector.

Reaffirmed June 2018

PCI Express® on VPX Fabric Connector: The objective of this standard is the implementation of the PCI Express® Fabric in the VITA46 environment and to define the mapping of the PCI Express® Links on the VPX Connector.

Reaffirmed August 2018

Gigabit Ethernet Control Plane on VPX: The objectives of this standard are to assign Gigabit Ethernet Port mappings for the purpose of Control Plane communication onto the VPX connectors for both 3U and 6U form factors and to provide rules and recommendations for the interoperable implementation and use of said Gigabit Ethernet Port mappings.

Reaffirmed: August 2018

Ethernet on VPX Fabric Connector: The objectives of this standard are to assign backplane Ethernet links to the VPX P1/J1 connector and to provide rules and recommendations for the use of Ethernet over backplane media.

PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules Standard: This VITA 46 (VPX) subsidiary standard defines PMC or XMC mezzanine rear I/O pin mappings to VITA 46.0 plug-in module backplane connectors.

Rear Transition Module for VPX: This standard defines a rear transition module (RTM) for VPX applications.

System Management on VPX: This specification defines a system management architecture on VPX.

Higher Data Rate VPX: This standard defines a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higher data rate connectors compliant to VITA 46.30 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

Requirements for Environments, Design and Construction, Safety, and Quality for Plug-In Modules Standard

Mechanical Standard for Microcomputers Using Ruggedized Enhanced Design Implementation (VPX REDI): This standard defines a mechanical implementation for Plug-In Modules. Two types of Plug-In Modules are defined: Type 1 and Type 2. Both Type 1 and Type 2 Plug-In Modules take advantage of increased slot pitch to provide enhanced thermal performance and increased structural durability. Type 1 units support Two Level Maintenance while Type 2 units do not.

This revision adds allowance for a 100 mm Plug-In Module depth and allows for additional pitches to be defined in the VITA 48 Dot Standards.

Mechanical Specification for Microcomputers Using REDI Air Cooling: This standard defines the mechanical requirements that are needed to insure the mechanical interchangeability of air cooled 3U and 6U plug-in units and define the features required to achieve 2 Level Maintenance compatibilly.

Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility.

This revision adds a 100 mm depth and multiple pitches at 0.2" increments.

Mechanical Standard for VPX REDI, Liquid Flow Through Cooling: This standard establishes the mechanical design requirements for a LFT cooled electronic VPX module.

Mechanical Standard for Electronic Plug-in units Using Air Flow Through Cooling: This standard establishes the design requirements for an air-flow-through cooled plug-in unit with a form factor as close to 6U as possible while retaining the VITA 46 connector layout. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components and circuit boards, this plug-in unit uses a compact core heat exchanger located within the central heat sink of the unit. (Reaffirmed 2017)

Mechanical Standard for Electronic Plug-in units using Air Flow-By™ Cooling Technology: 

This standard defines a detailed mechanical implementation for Air Flow-By cooling and sealing technologies applied to plug-in modules, backplanes, and sub-racks as defined in VITA 46/48. Air Flow-By cooling seals, environmentally and EMI, the PCBA within heat exchanging covers, convectively cooling the assembly without exposing the PCBA to the cooling air.

This revision provides additional design clarity, removes dependencies on external documentation, adds requirements for plug-in module specifications, and updates recommendations to better guide design practice.

Mechanical Standard for VPX REDI, Air Flow Through Cooling, 1.0" to 1.5" Pitches: This document describes an open standard for the design requirements for an airflow-through cooled plug-in module having 3U and 6U form factors while retaining the VITA 46.0 connector layout. Unlike using cooling air impinged directly upon the components and circuit boards, this plug-in module uses a finned heat exchanger frame located within the central section of the assembly to top cool primary circuit board components as well as mezzanine board components. Both 3U and 6U standard form factors are offered using 3 defined pitch spacings, with options to have alternate air flow intake and exhaust paths. The plug-in modules of this standard exhibit a weight reduction and cost savings by eliminating both wedge retainer usage and module lever usage by way of using light weight jack screws for plug-in module insertion and extraction into a subrack chassis. The intention of this standard is to optimize SWAP-C (Size, Weight, Power, Cost).

VITA Radio Transport (VRT) Standard: The VITA Radio Transport (VRT) standard defines a transport-layer protocol designed to promote interoperability between RF (radio frequency) receivers and signal processing equipment in a wide range of applications.

VITA Radio Link Layer Protocol (VRL) Standard: This standard specifies an optional encapsulation protocol for VITA-49.0 (VRT) packets.

VRT Standard for Electromagnetic Spectrum: Defines a signal/spectrum protocol that expresses spectrum observation, spectrum operations, and capabilities of RF devices. This is done independent of manufacturer, equipment type, point of use in an architecture and application. The intent of the VRT protocol is to enable RF systems to migrate from proprietary stove-pipe architectures to interoperable multi-function architectures.

Spectrum Survey Interoperability Standard: This document specifies an interoperability specification that is applicable to spectrum-survey applications. It is intended to foster high-throughput and adaptable processing in a large-scale environment. It specifically considers the needs of devices based around 32-/64-bit general-purpose processors (GPP) and FPGAs that utilize Internet Protocol (IP) as the underlying transport between processing devices.

Reliability Prediction: This document provides an electronics failure rate prediction standard, and establishes a Community of Practice. It addresses the limitations of existing prediction practices with a series of subsidiary specifications that contain the “best practices” within industry for performing electronics failure rate predictions. The development of ANSI/VITA 51.0 and the subsidiary specifications is an effort to give the mean time between failure (MTBF) calculations consistency and repeatability. 

Designation corrected to ANSI/VITA 51 - 2012 (R2018). Standard was revised in 2012 and reaffirmed with no changes in 2018.

Reliability Prediction MIL-HDBK-217 Subsidiary Standard: This specification provides standard defaults and methods to adjust the models in MIL-HDBK-217F Notice 2. This is not a revision of MIL-HDBK-217F Notice 2 but a standardization of the inputs to the MIL-HDBK-217F Notice 2 calculations to give more consistent results.

Reaffirmed: October 10, 2018

Physics of Failure Reliability Predictions: This standard provides processes, instructions and default parameters for using the Physics of Failure (PoF) approach for modeling the reliability of electronic products. It includes a discussion of the philosophy, context for use, definitions, models for key failure mechanisms, definition of the input data required, default values if technically feasible or the typical range of values as a guideline. It defines how modeling results are interpreted and used. It requires the documentation of modeling inputs, assumptions made during the analysis, modifications to the models and rationale for the analysis.

Qualification and Environmental Stress Screening in Support of Reliability Predictions: This standard provides rules, permissions, and observations to assure that cost effective Qualification and Environmental Stress Screening support valid reliability predictions and enhance electronics reliability. It includes a discussion of the systems engineering relationships between Qualification, Environmental Stress Screening, and reliability.

FPGA Mezzanine Card Plus (FMC+) Standard: This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mechanical standard. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Additional signals to support backplane reference clock and synchronization have been added. The VITA 57.4 specification is backwards compatible in that a VITA 57.4 carrier card can still support a VITA 57.1 FMC.

Alternative Connector for VPX: This standard provides an alternate connector to the one specified in the VITA 46.0 VPX Baseline Standard. Because the 46.0 and the 60.0 connectors are not intermateable, a VITA 60.0 module will not plug into a VITA 46.0.0 backplane and vice versa. However, the VITA 60.0 standard provides VPX users with the flexibility to choose a VPX module and backplane connector combination for their specific application requirements.

XMC 2.0: This standard is based upon VITA 42.0 XMC.  It defines an open standard for supporting high-speed, switched interconnect protocols on the existing, widely deployed XMC form factor.  XMC 2.0 utilizes a ruggedized, higher speed mezzanine interconnect based on pin and socket technology featuring multiple points of contact.  This revision addresses additional connector stack heights, lower mating force variants and support for higher data rate protocols.

Modular Power Supply Standard: This standard provides requirements building a power supply module that can be used to power a VPX chassis. The module will fit within the standard envelope defined for VPX modules in the VITA 48.x standards.

This revision updates the standard to better define current configurations and usage. The changes are delineated in the Forward of this standard.

This standard provides requirements for a Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module that can be used to power a VPX chassis in the VITA 62 family of standards. The Plug-In Module will fit within the standard envelope defined for VPX Plug-In Modules in the VITA 48.0 standards.

Modular Power Supply Standard: This standard provides requirements for building a 270 volt/3U or 6U class power supply module that can be used to power a VPX chassis in the VITA 62 family of standards in high altitude applications. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.

Hyperboloid Alternative Connector for VPX: This document describes an open standard for VITA 63.0 Hyperboloid Alternative Connector for VPX. This standard provides an alternative connector to the one specified in the VITA 46.0 VPX Baseline Standard.

OpenVPX: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses Plug-In Module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of Slot, Backplane, Module, and Standard Development Chassis Profiles.

This revision adds additional communication protocols, including protocols for supporting video. The associated VITA 65.1 adds Connector Modules and Slot Profile dash options to support 75 Ω coax.

Includes ANSI/VITA 65.1 profile tables. Excel version available at www.vita.com/Supporting-Information.

Optical Interconnect on VPX - Base Standard: The VITA 66.0 base standard defines physical features of a stand-alone compliant blind mate Optical Interconnect for use in VPX systems.

Optical Interconnect on VPX - MT Variant: The VITA 66.1 standard defines an MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Optical Interconnect on VPX - ARINC 801 Termini Variant: The VITA 66.2 standard defines an ARINC 801 Termini Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Reaffirmed August 2018

Optical Interconnect on VPX - Mini-Expanded Beam Variant: The VITA 66.3 standard defines an MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Reaffirmed: September 28, 2018

Optical Interconnect on VPX - Half Width MT Variant: The VITA 66.4 standard defines a Half Width MT Variant blind mate fiber optic interconnect for use with VPX backplanes and plug-in modules.

Optical Interconnect on VPX - Hybrid Variants: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug-In Module and floating displacement on the backplane.

Errata added June 14, 2024.

Coaxial Interconnect on VPX - Base Standard: The objective of this standard is to establish a structure for implementing blind mate analog coaxial interconnects with VPX backplanes and plug-in modules, and to define a specific family of interconnects and configurations within that structure.

Coaxial Interconnect on VPX, 3U, 4 Position, SMPM Configuration: The objective of this standard is to detail the configuration and interconnect within the structure of VITA 67.0 enabling a 3U VITA 46 interface containing multi-position blind mate analog connectors with up to 4 SMPM contacts.

Coaxial Interconnect on VPX, 8 Position SMPM Configuration: The objective of this standard is to detail the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connectors with up to 8 SMPM contacts each able to be located in positions P2/J2 to P6/J6.

Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane: This document describes an open standard for configuration and interconnect within the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane.  This revision adds 75-Ohm SMPM and 75-Ohm NanoRF contact interfaces to support video applications.

VPX Compliance Channel: VITA 68.0 is the Base Standard of the VITA 68.x family of standards for signal integrity compliance of VPX systems and components.This standard provides an overview of the VITA 68.x family of standards and defines common requirements for VPX modules and VPX backplanes that apply across the range of VITA 68.x standards.

Fixed Signal Integrity Budget: This standard defines a VPX compliance channel fixed signal Integrity budget including module performance criteria and common backplane performance criteria required to support multiple fabric types across a range of defined baud rates.

VPX Standard S-Parameter Definition: This standard leverages the VITA 68.0 S-parameter definition and expands upon how the S-parameters are formatted and named to help system integrators easily take multiple vendor S-parameters, concatenate them together to analyze an entire channel from one Module to another Module.

VNX - Compliant System Small Form Factor Module: This standard meets the growing needs for improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module, whilst leveraging many proven features of existing VITA standards.

This edition documents the migration from VITA 74 VNX to VITA 90 VNX+ family of standards, adds revised voltage levels for specific signals, as well as corrected connector part numbers and drawings.

Ruggedized 10 Gbaud Bulkhead Connector Standard: Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables

SpaceVPX Systems standard: This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications.  Such systems support a wide variety of use cases across the aerospace community.  This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards. This revision adds additional profiles, additional communication protocols (such as Ethernet), higher speed copper connectors, and an updated naming methodology for Slot and Module Profiles.

High Voltage Input Sealed Connector Power Supply Standard: This standard defines an environmentally sealed connector pair which is compatible with the backplane footprint as defined in VITA 62.0 for 3U power supplies operating in harsh environments operating off of a high voltage input.

This document describes an open standard to define High Density Circular MT Connectors utilizing plug and receptacle shells from the MIL-DTL-38999 family.

This document defines a standard for improved electrical/mechanical mezzanine connectors for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.

This standard defines a connector system that provides higher pin density to the backplane for VPX applications.

FPGA Mezzanine Card (FMC) Standard: This standard describes the compliance requirements for an FPGA Mezzanine Card (FMC) IO module which utilizes a mezzanine module to provide for a low overhead protocol bridge between a carrier card's front panel IO and an FPGA processing device on the carrier card. (Revised in 2019)

Includes ANSI/VITA 57.4-2018 +Errata.

Special payment of $2,850 for Viettel documents.

Item    Description    Price
1    ANSI/VITA 40-2020 Service and Status Indicator Standard    $ 50.00
2    ANSI/VITA 42.0-2021 XMC: Switched Mezzanine Card (XMC) Auxiliary Standard    $ 50.00
3    VITA 42.1-2006 (S2022) XMC Parallel RapidIO 8/16 LP-LVDS Protocol Layer Standard    $ 50.00
4    ANSI/VITA 42.2-2006 (S2018) XMC Serial RapidIO Protocol Layer Standard    $ 25.00
5    ANSI/VITA 42.3-2020 XMC PCI Express Protocol Layer Standard    $ 50.00
6    ANSI/VITA 42.6-2009 (R2015) XMC 10 Gigabit Ethernet 4-Lane Protocol Layer Standard    $ 25.00
7    ANSI/VITA 46.0-2023 VPX Baseline Standard    $ 100.00
8    ANSI/VITA 46.1-2007 (S2018) VMEbus Signal Mapping on VPX    $ 50.00
9    ANSI/VITA 46.3-2012 (R2018) Serial RapidIO on VPX Fabric Connector    $ 50.00
10    ANSI/VITA 46.6-2013 (R2018) Gigabit Ethernet Control Plane on VPX    $ 50.00
11    ANSI/VITA 46.9-2018 PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules     $ 75.00
12    ANSI/VITA 46.11-2022 System Management on VPX    $ 100.00
13    ANSI/VITA 46.30-2020 Higher Data Rate VPX    $ 50.00
14    VITA 46.31-2020-VDSTU Higher Data Rate VPX - Solder Tail in Blind via    $ 50.00
15    VITA 47 Bundle Includes AV47.0, AV47.1, AV47.2 and AV47.3    $ 75.00
16    ANSI/VITA 48.0-2022 Mechanical Standard for Microcomputers using Ruggedized Enhanced Design Implementation (REDI)    $ 25.00
17    ANSI/VITA 48.1-2020 Mechanical Standard for VPX REDI Air Cooling    $ 50.00
18    ANSI/VITA 48.2-2022 Mechanical Standard for VPX REDI Conduction Cooling    $ 50.00
19    ANSI/VITA 48.4-2022 Mechanical Standard for VPX REDI Liquid Flow Through Cooling    $ 50.00
20    ANSI/VITA 48.5-2010 (R2017) Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.52" Pitch    $ 50.00
21    ANSI/VITA 48.7-2023 Mechanical Standard for VPX REDI Air Flow-By ™Cooling    $ 50.00
22    ANSI/VITA 48.8-2022 Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.0"to 1.5" Pitches    $ 50.00
23    ANSI/VITA 49.2-2017 VITA Radio Transport (VRT) Standard for Electromagnetic Spectrum: Signals and Applications    $ 100.00
24    ANSI/VITA 49A-2015 (R2021) Spectrum Survey Interoperability Standard    $ 50.00
25    ANSI/VITA 51.0-2012 (R2018) Reliability Prediction    $ 25.00
26    ANSI/VITA 51.1-2013 (R2018) Reliability Prediction MIL-HDBK-217 Subsidiary Standard    $ 50.00
27    ANSI/VITA 51.2-2016 Physics of Failure Reliability Predictions    $ 75.00
28    ANSI/VITA 51.3-2010 (R2016) Qualification and Environmental Stress Screening in Support of Reliability Predictions    $ 25.00
29    VITA 57 Bundle includes AV57.1 and AV57.4    $ 100.00
30    VITA 58.0-2009 (S2022) Line Replaceable Integrated Electronics Chassis Standard    $ 25.00
31    VITA 58.1-2013 (S2022) Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis    $ 25.00
32    ANSI/VITA 60-2012 (R2018) Alternative Connector for VPX    $ 50.00
33    ANSI/VITA 61.0-2022 XMC 2.0    $ 25.00
34    ANSI/VITA 62.0-2022 Modular Power Supply Standard    $ 100.00
35    ANSI/VITA 62.1-2023 Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Std    $ 50.00
36    ANSI/VITA 62.2-2020 Modular Power Supply Standard for 270v Applications    $ 100.00
37    ANSI/VITA 63.0-2015 (R2022) Hyperboloid Alternative Connector for VPX    $ 50.00
38    VITA 65 Bundle includes AV65.0 Base Standard and  AV65.1 Profile Tables    $ 100.00
39    ANSI/VITA 66.0-2016 Optical Interconnect on VPX –Base Standard    $ 25.00
40    VITA 66.1-2012 Optical Interconnect on VPX –MT Variant    $ 25.00
41    ANSI/VITA 66.2-2013 (R2018) Optical Interconnect On VPX –ARINC 801 Termini Variant    $ 25.00
42    ANSI/VITA 66.3-2012 (R2018) Optical Interconnect on VPX - Mini-Expanded Beam Variant    $ 25.00
43    ANSI/VITA 66.4-2016 Optical Interconnect On VPX –Half Width MT Variant    $ 25.00
44    ANSI/VITA 66.5-2022 Optical Interconnect on VPX - Hybrid Variants    $ 50.00
45    ANSI/VITA 67.0-2019 Coaxial Interconnect on VPX –Base Standard    $ 25.00
46    ANSI/VITA 67.1-2019 Coaxial Interconnect on VPX, 4 Position SMPM Configuration    $ 25.00
47    ANSI/VITA 67.2-2020 Coaxial Interconnect on VPX, 8 Position SMPM Configuration    $ 25.00
48    ANSI/VITA 67.3-2024 Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane    $ 50.00
49    ANSI/VITA 68.0-2017 + Errata VPX Compliance Channel Standard    $ 25.00
50    ANSI/VITA 68.1-2017 + Errata VPX Compliance Channel - Fixed Signal Integrity Budget Std    $ 50.00
51    ANSI/VITA 68.2-2021 VPX Standard S-Parameter Definition    $ 25.00
52    ANSI/VITA 74.0-2022 Compliant System Small Form Factor Module (VNX) Base Standard    $ 100.00
53    ANSI/VITA 76-2016 (R2021) High Performance Cable Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables    $ 50.00
54    ANSI/VITA 78.0-2022 SpaceVPX System Standard    $ 100.00
55    ANSI/VITA 86-2019 High Voltage Input Sealed Connector Power Supply    $ 25.00
56    ANSI/VITA 88.0-2021 Switched Mezzanine Card Plus (XMC+) Standard    $ 50.00
    Total    $2, 850.00

Board Level Live Insertion: This standard defines several methodologies for using VMEbus modules in a live insertion framework.

IP Module: This standard defines the requirements for a business card sized mezzanine module printed circuit board.

IP I/O Mapping to VME64x: This standard defines the pin assignments from IP Modules to the VME64x P0 and P2 connectors.

RACEway Interlink on VME: This standard defines a high speed circuit switched point to point interconnect for use between VMEbus modules via the P2 connector.

SCSA: This standard defines an isochronous backplane bus for telephony applications on the VMEbus P2 connector.

SCSA Extensions: This standard provides feature extensions to the VITA 6.0 standard.

M-Module: This standard defines a mezzanine module specification for small sized printed circuit boards.

Front Panel Data Port: This standard defines a point to point data interconnect for use on front panel Eurocard modules.

VME64 Extensions for Physics: This standard defines a series of recommended practices for the use of VMEbus in the physics community.

Myrinet: This standard defines a packet switched interconnect protocol for implementation in a VMEbus environment.

PC*MIP Standard: 

2mm Equipment Practice for Eurocard Systems: This standard defines an equipment practice based on IEC 61076-4-101, subracks, racks, and printed boards based on the Euroboard form factor.

2mm Equipment Practice for Conduction Cooled Eurocard Systems: This standard provides the mechanical dimensions for conduction cooled Euroboard systems that use 2mm connectors. Released in 2002 and revised in 2008.

Gigabit Ethernet on VME64x Backplanes: This standard defines a pinout and interconnection methodology for implementing a 10/100/1000BASE-T Ethernet switched network on a VME64x backplane.

System Management on VME: This standard defines a methodology for using IPMI for System Management of VME systems. Reaffirmed in 2008. Stabilized in 2013.

PCI-X for PMC and Processor PMC: This standard integrates the PCI-X capability from PCI to PMC-based products, including standard PMCs as well as Processor PMCs.

VXS - VMEbus Switched Serial Standard: This standard defines a method for using switched serial fabrics within the VMEbus framework.

VXS 4X InfiniBand Protocol Layer Standard: This standard describes a method for using the InfiniBand protocol on VITA 41.0, VXS.

VXS 4X Serial RapidIOT Protocol Layer Standard: This standard describes a method for implementing Serial Rapid I/O on VITA 41.0, VXS.

VXS 1X Gbit Ethernet Control Channel Standard: This standard describes a method for implementing ethernet as a control channel on ANSI/VITA 41.0, VXS.

XMC Switched Mezzanine Card: Parallel RapidIOT 8/16 LP-LVDS Protocol Layer Standard - This standard defines the implementation of Parallel RIO on VITA 42.0, XMC.

Higher Data Rate VPX, Solder Tail: This standard defines a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher data rate connectors compliant to VITA 46.31 are intermateable to legacy VITA 46.0 connectors and follow the same form factor.

Commercial Technology Market Surveillance: This standard describes the types of market surveillance data needed by Department of Defense program managers in order to develop and implement technology refresh plans.

Line Replaceable Integrated Electronics Chassis Standard: This standard provides common design and performance requirements for a family of integrated electronic chassis incorporating updated industry standard high speed electronic assemblies and designed for rugged environments

Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis: The objective of this standard is to identify the particular requirements for a chassis configuration conforming to the VITA 58.0 base standard.

This document defines a standard reference model approach for OpenVPX Signal Integrity compliance at baud rates above 10.3125 Gbaud. It defines reference OpenVPX Plug-In Module and backplane s-parameter models that can be used to create end-end OpenVPX reference channels in conjunction with reference VPX connector and device s-parameter models. Signal Integrity compliance for an OpenVPX Plug-In Module or backplane is based on simulation of end-end channel compliance against the requirements of the applicable protocol standard.

VITA 75 Rugged Small Form Factor - Base Standard: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes overall subsystem attributes such as the envelope of the subsystem (box) and the organization of the dot specifications.

Rugged Small Form Factor - Subsystem I/O Interfaces: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of front panels, connectors, I/O signal pin assignments, and power for VITA 75 subsystems.

Rugged Small Form Factor - Cooled via Free Air Convection: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of mounting and cooling for free air convection cooled VITA 75 subsystems.

Rugged Small Form Factor - Cooled via Conduction to Cold Plate: This is a VITA Draft Standard for Trial Use. This draft standard for a rugged small form factor describes the standardization of mounting and cooling for conduction to a cold plate cooled VITA 75 subsystem.

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Special partial split payment of $150 for Viettel. Second split payment of $2,850 combinded will pay the full $3,000 annual dues for new membership.

Annual dues for Regular I membership renewal at VITA

A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. The handbook complements the VMEbus standard and provides examples and explanatory text for all facets of the VMEbus architecture.

Alternate payment portal for attendees of VSO Face to Face (F2F) meetings.  Only purchase if normal event payment method is failing.